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Practical guide to the packaging of electronics: thermal and mechanical design and analysis, third edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues.
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( dekker mechanical engineering) ali jamnia practical guide to the packaging of electronics, thermal and mechanical design and analysis crc press, marcel dekker ( 2002).
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Practical guide to the packaging of electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
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Practical guide to the packaging of electronics - thermal and mechanical design and analysis (3rd edition) details a definitive guide for practitioners new to the field or requiring a refresher course, this book provides an understanding of system failures and helps identify the areas where they can occur.
This reviewer says “kudos” to ali jamnia for going “back to the building blocks” of physical design of electronics assemblies. Perhaps the title should have been “practical guide to the packaging of electronics assemblies,” since the product value of electronics is not significant unless they are in some kind of assembly.
Practical guide to the packaging of electronics discussespackaging/enclosure design and reliability thermal, junction-to-case, and contact interface resistance.
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As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical guide to the packaging of electronics: second edition, thermal and mechanical design and analysis provides a basic understanding of the issues that.
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A package in programming contains multiple classes and their related components (interfaces and annotations). A package in programming contains multiple classes and their related components (interfac.
Practical guide to the packaging of electronics, second edition: thermal and mechanical design and analysis written by ali jamnia is very useful for mechanical engineering (mech) students and also who are all having an interest to develop their knowledge in the field of design, automobile, production, thermal engineering as well as all the works related to mechanical field.
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